Technical Analysis for ASX - Advanced Semiconductor Engineering, Inc.
Grade | Last Price | % Change | Price Change |
---|---|---|---|
D | 10.52 | 0.19% | 0.02 |
Earnings due: May 24
*** please verify all earnings dates ***ADX | Long Term | Intermediate Term | Short Term |
---|---|---|---|
Weak or Absent | Up | Down | Up |
Date | Alert Name | Type | % Chg |
---|---|---|---|
Spinning Top | Other | 0.00% | |
Overbought Stochastic | Strength | 0.00% | |
Expansion Pivot Sell Setup | Bearish Swing Setup | 0.19% | |
Stochastic Reached Overbought | Strength | 0.19% | |
Overbought Stochastic | Strength | 0.19% | |
50 DMA Resistance | Bearish | -1.96% | |
Above Upper BB | Strength | -1.96% | |
Gapped Up | Strength | -1.96% | |
Upper Bollinger Band Touch | Strength | -1.96% | |
Crossed Above 20 DMA | Bullish | 0.29% |
Alert | Time |
---|---|
10 DMA Support | 3 days ago |
Expansion Pivot Sell Entry | 3 days ago |
Fell Below Previous Day's Low | 3 days ago |
Possible NR7 | 3 days ago |
Possible Inside Day | 3 days ago |
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- Earnings date: 05/24/2024
Advanced Semiconductor Engineering, Inc. Description
Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, and Europe. It offers packages, such as flip-chip ball grid array (BGA), flip-chip CSP, advanced chip scale packages, and IC wirebonding packages; stacked die solutions in various package types, such as stacked die quad flat no-lead and hybrid BGAs containing stacked wire bond and fc die; and copper wire bonding solutions, as well as module assembly services, and interconnect materials. The company's testing services include front-end test engineering testing, wafer probing, logic/mixed-signal/RF/discrete final testing services, memory final testing services, other test related services, and drop shipment services. It also offers electronics manufacturing services for use in a range of end-use applications, primarily computers, peripherals, communications, industrial applications, automotive electronics, and storage and server applications. It offers package and testing services for a range of products with end-use applications in the communications, computers, consumer electronics, industrial, and automotive sectors. The company was founded in 1984 and is based in Kaohsiung, Taiwan.
Classification
Sector: Technology
Industry: Semiconductors
Keywords: Electronics Semiconductor Consumer Electronics Integrated Circuits Electrical Engineering Electronic Engineering Semiconductor Device Fabrication Semiconductor Devices Electronics Manufacturing Packaging Automotive Electronics Electronics Manufacturing Services Shipment Services Flip Chip Chip Scale Package Ball Grid Array
Indicator | Bull Case | Neutral / Hold | Bear Case |
---|---|---|---|
50 DMA | |||
200 DMA | |||
ADX Trend | |||
Oversold / Overbought | |||
Relative Strength |
Indicator | Value |
---|---|
52 Week High | 11.68 |
52 Week Low | 6.7357 |
Average Volume | 5,769,688 |
200-Day Moving Average | 9.03 |
50-Day Moving Average | 10.71 |
20-Day Moving Average | 10.34 |
10-Day Moving Average | 10.46 |
Average True Range | 0.26 |
RSI (14) | 51.22 |
ADX | 11.39 |
+DI | 26.93 |
-DI | 23.45 |
Chandelier Exit (Long, 3 ATRs) | 9.97 |
Chandelier Exit (Short, 3 ATRs) | 10.67 |
Upper Bollinger Bands | 10.73 |
Lower Bollinger Band | 9.94 |
Percent B (%b) | 0.73 |
BandWidth | 7.60 |
MACD Line | -0.01 |
MACD Signal Line | -0.05 |
MACD Histogram | 0.0443 |
Pivot Point Level | Traditional / Classic | Fibonacci | Demark | Woodie | Camarilla |
---|---|---|---|---|---|
Resistance 4 (R4) | 10.76 | ||||
Resistance 3 (R3) | 10.77 | 10.69 | 10.72 | ||
Resistance 2 (R2) | 10.69 | 10.63 | 10.69 | 10.71 | |
Resistance 1 (R1) | 10.61 | 10.59 | 10.57 | 10.60 | 10.69 |
Pivot Point | 10.53 | 10.53 | 10.52 | 10.53 | 10.53 |
Support 1 (S1) | 10.45 | 10.47 | 10.41 | 10.44 | 10.35 |
Support 2 (S2) | 10.37 | 10.43 | 10.37 | 10.33 | |
Support 3 (S3) | 10.29 | 10.37 | 10.32 | ||
Support 4 (S4) | 10.28 |